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Heat Resistant ESD-Proof Tray For Chip Module Packaging And Secure Handling Property ESD Or Non-ESD

Shenzhen Hiner Technology Co.,LTD
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Heat Resistant ESD-Proof Tray For Chip Module Packaging And Secure Handling Property ESD Or Non-ESD

Brand Name : Hiner-pack

Model Number : HN24030

Place Of Origin : Shenzhen, China

Certification : ISO 9001 ROHS SGS

MOQ : 1000 Pcs

Price : $0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities)

Packaging Details : It Depends On The QTY Of Order And Size Of Product

Delivery Time : 5~8 Working Days

Payment Terms : T/T

Supply Ability : 4000PCS~5000PCS/per Day

Warpage : <0.2mm

Property : ESD Or Non-ESD

Heat Resistant : Yes

Surface Resistance : 1.0x10E4~1.0x10E11Ω

Material : ABS, PC, PPE, MPPO, PEI, HIPS...etc.

Use : Transport, Storage, Packing

Capacity : Holds Multiple Bare Dies

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ESD-Proof Tray For Chip Module Packaging And Secure Handling

The Chip Tray & Waffle Pack series from Hiner-pack offers a safe and convenient solution for packaging and transporting a variety of microelectronic components including Chip, Die, COG, Optoelectronic devices, and more. These products come in various sizes and materials to suit different needs, with product specifications available in 2 inches and 4 inches. The materials used include Antistatic/Conductive ABS and PC, and can also be tailored to meet specific customer requirements.

Features:

The products are crafted from ESD-safe, non-sloughing, and carbon-powder-free clean polymers.

They are further reinforced with carbon fiber to enhance their strength and ensure permanent ESD protection. This design feature provides added durability and longevity to the products.

With the capability of withstanding bake temperatures of up to 180°C, these items offer versatility in various environments and applications. This high temperature tolerance adds to their practicality and usability.

Available in industry-standard formats, these products can also be customized to meet specific requirements and preferences. This customization option allows for tailored solutions that cater to individual needs.

Technical Parameters:

HN24030 Technical Data Ref.
Base Information Material Color Matrix QTY Pocket Size
ABS Black 8*8=64PCS 3.65*3.65*0.8mm
Size Length * Width * Height (according to customer's requirement)
Feature Durable; Reusable; Rcofriendly; Biodegradable
Sample A. The free samples: Choosen from existing products.
B. Customized samples as per your design/demand
Accessory Cover/Lid, Clip/Clamp, Tyvek paper
Artowrk Format PDF,2D,3D

Specifications:

The external dimensions of waffle pack chip trays are well established: 2-inch is two inches square, 4-inch is four inches square, and so on. The variability is in the pocket size, geometry and count.

Waffle pack trays are usually specified by a few characteristics.

  • External size – 2”, 4”, etc.
  • Pocket size or pocket count – choosing one will dictate the other
  • Temperature rating – the maximum temperature at which the tray will be used

Custom waffle pack trays require additional specification.

  • Component geometry
  • Special process requirements
  • Quantity of trays needed or quantity of components that will be processed (this helps determine the appropriate manufacturing process to be used for tray manufacturing)

Product Tags:

Secure Handling Chip Module Packaging Tray

      

Heat Resistant Chip Module Packaging Tray

      

ESD-Proof Chip Module Packaging Tray

      
Quality Heat Resistant ESD-Proof Tray For Chip Module Packaging And Secure Handling Property ESD Or Non-ESD wholesale

Heat Resistant ESD-Proof Tray For Chip Module Packaging And Secure Handling Property ESD Or Non-ESD Images

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